High-Baudrate SiP and InP Modulators for Data Center Interconnects
2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM 2023): Proceedings
2023
Oskars Ozoliņš,
Armands Ostrovskis,
Toms Salgals,
Benjamin Kruger,
Fabio Pitallo,
Joharifar Mahdieh,
Richard Schatz,
Michael Koenigsmann,
Yuchuan Fan,
Urban Westergren,
Haik Mardoyan,
Lu Zhang,
Sandis Spolītis,
Xianbin Yu,
Markus Gruen,
Vjačeslavs Bobrovs,
Hadrien Louchet,
Xiaodan Pang
The booming internet traffic sets highly challenging requirements for high-speed computing where low latency is required. This leads to a choice of intensity modulation and direct detection system with the highest baudrate possible. Furthermore, record baudrate supporting modulators will be the key technology for future optical interconnect applications. Therefore, we demonstrated silicon photonics and indium phosphide modulators at highest possible sysmbolrate.
Keywords
Data Center interconnects | indium phosphite | on-off keying | pulse amplitude modulation | Silicon photonics
DOI
10.23919/SoftCOM58365.2023.10271574
Hyperlink
https://ieeexplore.ieee.org/document/10271574
Ozoliņš, O., Ostrovskis, A., Salgals, T., Kruger, B., Pitallo, F., Mahdieh, J., Schatz, R., Koenigsmann, M., Fan, Y., Westergren, U., Mardoyan, H., Zhang, L., Spolītis, S., Yu, X., Gruen, M., Bobrovs, V., Louchet, H., Pang, X. High-Baudrate SiP and InP Modulators for Data Center Interconnects. In: 2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM 2023): Proceedings, Croatia, Split, 21-23 September, 2023. Piscataway: IEEE, 2023, pp.1-6. ISBN 979-8-3503-0107-6. e-ISSN 1847-358X. Available from: doi:10.23919/SoftCOM58365.2023.10271574
Publication language
English (en)