Stress Relaxation Mechanism by Strain in the Si-SiO2 System and Its Influence on the Interface Properties
Solid State Phenomena
2011
D. Kropman,
E. Mellokov,
T. Kärner,
T. Laas,
Artūrs Medvids,
Pāvels Onufrijevs,
Edvīns Daukšta
The results of the investigation of stresses relaxation by strains in use of analyze of EPR
spectra, IR absorption spectra, SEM and samples deflection are presented. It has been shown that
stresses relaxation mechanism depends on the oxidation conditions: temperature, cooling rate, oxide
thickness. In the Si-SiO2-Si3N4 system the relaxation of stresses by the strains occur due to the
opposite sign of the thermal expansion coefficients of Si-SiO2 and Si3N4 on Si. Laser irradiation was
used to modify the stresses in system.
Atslēgas vārdi
Si-SiO2-Si3N4 interface, EPR, point defects, stress relaxation
DOI
10.4028/www.scientific.net/SSP.178-179.259
Hipersaite
https://www.scientific.net/SSP.178-179.259
Kropman, D., Mellokov, E., Kärner, T., Laas, T., Medvids, A., Onufrijevs, P., Daukšta, E. Stress Relaxation Mechanism by Strain in the Si-SiO2 System and Its Influence on the Interface Properties. Solid State Phenomena, 2011, Vol.178-179, 259.-262.lpp. ISSN 1662-9779. Pieejams: doi:10.4028/www.scientific.net/SSP.178-179.259
Publikācijas valoda
English (en)